In this Agile in Hardware episode, Milad Maleki and Markus Thut of Hitachi Energy Ltd. describe the pioneering methods and challenges of Agile hardware development in high-power semiconductor manufacturing. From introducing cutting-edge RoadPak technology for Formula E racing to optimizing consumer EV solutions, they share a fresh perspective on agile practices beyond the traditional software domain. Join us as we uncover the intricacies of an iterative approach to hardware design, production integration, and actionable insights for advancing Agile principles in complex hardware manufacturing.
The RoadPak Project: Pioneering eMobility Innovation
Milad and Markus kick off the discussion with the story behind the RoadPak project, a powerful technology supporting electric mobility and racing industries, including Formula E and Formula 1. Developed initially as a small-scale prototype, RoadPak has since evolved into a versatile solution with wide-reaching applications in consumer electric vehicles and fast-charging stations.
“From racing to consumer EVs, RoadPak’s journey showcases the transformative potential of scaling innovation from concept to consumer solutions.”
